Microelectronic Wiley sol Report - 네이버서식

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Microelectronic Wiley sol Report

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Microelectronic Wiley sol

John Wiley & Sons (Asia) Pte.

Foreword by C. P. Wong xiii

Foreword by Zhigang Suo xv

Preface xvii

Acknowledgments xix

About the Authors xxi

Part I Mechanics and Modeling 1

1 Constitutive Models and Finite Element Method 3

1.1 Constitutive Models for Typical Materials 3

1.1.1 Linear Elasticity 3

1.1.2 Elastic-Visco-Plasticity 5

1.2 Finite Element Method 9

1.2.1 Basic Finite Element Equations 9

1.2.2 Nonlinear Solution Methods 12

1.2.3 Advanced Modeling Techniques in Finite Element Analysis 14

1.2.4 Finite Element Applications in Semiconductor Packaging Modeling 17

1.3 Chapter Summary 18

References 19

2 Material and Structural Testing for Small Samples 21

2.1 Material Testing for Solder Joints 21

2.1.1 Specimens 21

2.1.2 A Thermo-Mechanical Fatigue Tester 23

2.1.3 Tensile Test 24

2.1.4 Creep Test 26

2.1.5 Fatigue Test 31

2.2 Scale Effect of Packaging Materials 32

2.2.1 Specimens 33

2.2.2 Experimental Results and Discussions 34

2.2.3 Thin Film Scale Dependence for Polymer Thin Films 39

2.3 Two-Ball Joint Specimen Fatigue Testing 41

2.4 Chapter Summary 41

References 43

3 Constitutive and User-Supplied Subroutines for Solders Considering Damage Evolution 45

3.1 Constitutive Model for Tin-Lead Solder Joi...(하략)

자료 (압축파일).zip